STPAYJD18DAPD72
Mfr:ST
Subcategory:External OS
Package:MICROMODULE D72
Packing Type:T&R 13" for MSQ=1 (Base=1)
MOQ:1
Product overview
STPAYJD18DAPD72-SCV Banking SOC Cless Chip_BI-MICROMODULE D72-ST. Datasheet & samples available — contact us for price & lead time.
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