STPAYF3BB1177BC3-SCV Banking SOC Cless Chip_BI-MICROMODULE D77-ST

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STPAYF3BB1177BC3

Mfr：ST

Subcategory：Internal OS

Package：MICROMODULE D77

Packing Type：T&R 13" for MSQ=1 (Base=1)

MOQ：1

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Product overview

STPAYF3BB1177BC3-SCV Banking SOC Cless Chip_BI-MICROMODULE D77-ST. Datasheet & samples available — contact us for price & lead time.

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