ST31P45075APB1
Mfr:ST
Subcategory:HW
Package:MICROMODULE D75 BL + SAW SHZ
Packing Type:T&R 13" for MSQ=1 (Base=1)
MOQ:1
Product overview
ST31P45075APB1-SCV Banking HW Chip_BI-MICROMODULE D75 BL + SAW SHZ-ST. Datasheet & samples available — contact us for price & lead time.
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